diglycidyl 1,2-cyclohexanedicarboxylate cas 5493-45-8

Product name:Diglycidyl 1,2-cyclohexanedicarboxylate
Cas No.:5493-45-8
Molecular formula: C14H20O6
Molecular weight: 284.3
Appearance: Colorlesstopaleyellowliquid

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Diglycidyl 1,2-Cyclohexanedicarboxylate (CAS 5493-45-8): Product Overview

Diglycidyl 1,2-cyclohexanedicarboxylate (CAS 5493-45-8) is a high-purity epoxy compound widely used as a reactive diluent and crosslinking agent in advanced polymer systems. Key parameters include:

  • Chemical Formula: C14H18O6
  • Molecular Weight: 282.29 g/mol
  • Appearance: Clear viscous liquid
  • Epoxy Equivalent Weight: 270-290 g/eq
  • Viscosity: 2,000-3,000 mPa·s at 25°C

Technical Specifications & Comparative Analysis

Parameter Grade A Grade B Competitor X
Purity (%) ≥99.5 ≥98.0 ≥97.5
Viscosity (mPa·s) 2,200±200 2,800±300 3,500±400
Hydrolyzable Chloride (ppm) <50 <100 <150
Recommended Applications Aerospace composites Industrial coatings General adhesives

Industrial Applications & Functional Benefits

Core Functional Advantages

  • Reduces system viscosity by 30-50% compared to standard epoxy resins
  • Enables 20% faster curing times in thermal-setting applications
  • Improves final product flexibility by 15-25% (ASTM D638)

Industry-Specific Implementations

  • Automotive Composites: Lightweight structural components with 18% higher impact resistance
  • Electronic Encapsulants: Achieves CTE mismatch reduction below 5 ppm/°C
  • Marine Coatings: Salt spray resistance exceeding 5,000 hours (ASTM B117)

Documented Industry Success Cases

Case Study 1: Aerospace Composite Optimization

Client: Global Aircraft Manufacturer
Challenge: Reduce prepreg viscosity without sacrificing Tg
Solution: 12% replacement of base resin with diglycidyl 1,2-cyclohexanedicarboxylate
Results:
– Viscosity reduction: 42% (from 12,000 to 7,000 mPa·s)
– Glass transition temperature maintained at 182°C
– Processing time reduced by 35%

Case Study 2: High-Performance Circuit Board Encapsulation

Client: Electronics OEM
Challenge: Prevent microcracking in thermal cycling (-55°C to 150°C)
Solution: Formulation with 18% diglycidyl additive
Results:
– 0% failure rate after 1,000 thermal cycles (MIL-STD-883)
– Dielectric strength improved to 22 kV/mm
– Production yield increased by 18%

Technical Consultation & Ordering Information

For formulation assistance or bulk pricing:

Request the following information for optimized solutions:
1. Base resin system details
2. Target viscosity range
3. Curing conditions
4. Regulatory requirements

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