ODPA CAS 1823-59-2

Chemical Name: 4,4′-Oxydiphthalic anhydride / ODPA
Synonyms: Oxydiphthalicanhydride; Bis-(3-phthalyl anhydride) ether
CAS No.: 1823-59-2
Molecular Formula: C16H6O7
Density: 1.696g/mLat 25°C(lit.)
Boiling point: 162°C(lit.)
Molecular Weight: 310.21
Appearance: White powder

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ODPA CAS 1823-59-2: Comprehensive Product Guide & User Insights

1. Product Overview & Specifications

ODPA (4,4′-Oxydiphthalic Anhydride), CAS 1823-59-2, is a high-purity aromatic dianhydride monomer critical for manufacturing advanced polyimide polymers. Its unique molecular structure enables exceptional thermal stability and mechanical performance in extreme environments.

Parameter Specification Competitor A (PMDA) Competitor B (BTDA)
Molecular Formula C16H6O7 C10H2O6 C16H6O6
Melting Point 228-232°C 286-288°C 198-202°C
Thermal Decomposition >450°C 380°C 400°C
Solubility DMAc, NMP, DMF Limited Moderate

2. Key Applications & Use Cases

2.1 High-Temperature Polyimide Films

ODPA-based films maintain structural integrity at 300-400°C, ideal for aerospace engine components and electric vehicle battery insulation.

2.2 Microelectronic Encapsulation

Ultra-low CTE (8-12 ppm/°C) prevents delamination in semiconductor packaging under thermal cycling conditions.

2.3 Composite Matrices

Enables carbon fiber-reinforced composites with 25% higher flexural strength than BTDA-based systems.

3. Performance Comparison with Alternatives

Property ODPA PMDA BTDA
Tg (°C) 310 385 275
Dielectric Constant (1MHz) 3.2 3.5 3.1
Moisture Absorption (%) 0.8 1.2 1.0

4. Industry Implementation Examples

4.1 Flexible Printed Circuits

Major Asian PCB manufacturer achieved 40μm-thick flexible circuits with 15% improved folding endurance using ODPA-based polyimides.

4.2 Satellite Components

European space contractor reduced antenna weight by 22% while maintaining -180°C to +150°C operational stability.

5. Client Success Stories

Case 1: Advanced Battery Solutions Co., Ltd.

Challenge: Required UL94 V-0 compliant insulation for 800V EV batteries
Solution: ODPA-based coating with 650°C glow-wire resistance
Result: 35% thinner insulation layers with zero thermal runaway incidents

Case 2: Precision Microelectronics Inc.

Challenge: Warpage issues in BGA packages during reflow
Solution: ODPA molding compound with CTE 8.5 ppm/°C
Result: Reduced warpage from 120μm to 18μm

6. Contact for Technical Consultation

Our material science team offers:

  • Custom formulation support
  • Batch-to-batch consistency testing
  • Regulatory compliance guidance

Contact our experts:
Email: info@vivalr.com
Tel: (86) 15866781826

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