Hexyldecyltrimethoxysilane (CAS 38205-60-6) Comprehensive User Guide
Table of Contents
- Product Overview & Specifications
- Key Applications & Functional Advantages
- Performance Comparison Analysis
- Industry-Specific Usage Scenarios
- Verified Client Success Stories
- Expert Consultation & Sample Requests
1. Product Overview & Technical Specifications
| Parameter | Specification |
|---|---|
| CAS Number | 38205-60-6 |
| Molecular Formula | C19H42O3Si |
| Molecular Weight | 346.6 g/mol |
| Appearance | Clear liquid |
| Purity | ≥95% (GC) |
| Boiling Point | 280°C (dec.) |
| Density | 0.92 g/cm³ (25°C) |
| Flash Point | 110°C |
2. Core Applications & Functional Properties
Primary Industrial Uses:
- Surface modification agent for inorganic/organic composites
- Crosslinking promoter in silicone rubber formulations
- Adhesion enhancer in polymer coatings
- Hydrophobic treatment for nanomaterials
Performance Advantages:
- Superior hydrolysis stability compared to shorter-chain silanes
- Enhanced thermal resistance (up to 280°C)
- Improved mechanical properties in composite materials
- Low VOC emission during curing process
3. Competitive Product Analysis
| Brand | Purity | Packaging | Key Differentiator |
|---|---|---|---|
| Sigma-Aldrich | 98% | 100g to 5kg | Lab-scale R&D focus |
| Gelest Inc | 95% | 1kg to 200kg | Industrial-grade volumes |
| Shin-Etsu | 97% | 25kg drums | Automotive-grade certification |
4. Industry Implementation Scenarios
Automotive Manufacturing:
Used in tire compound formulations to improve silica dispersion, reducing rolling resistance by 15-20% in premium tire lines.
Construction Materials:
Critical component in weather-resistant sealants, demonstrating 25% better UV stability than traditional formulations.
Electronics Encapsulation:
Enables moisture-resistant protection for microelectronics with <1% water absorption over 1000hrs 85°C/85% RH testing.
5. Verified Client Implementations
Case Study 1: European Automotive Supplier
- Challenge: Reduce VOC emissions in cabin components
- Solution: 2.5% hexyldecyltrimethoxysilane additive
- Result: Achieved 40% VOC reduction with maintained flexibility
Case Study 2: Asian Electronics Manufacturer
- Challenge: Prevent moisture-induced circuit failure
- Solution: 0.8% surface treatment concentration
- Result: Passed IPC-CC-830B standard with 100% yield improvement
6. Technical Consultation & Ordering
For formulation assistance or bulk pricing:
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