Poly(dicyclopentadiene-co-p-cresol) CAS 68610-51-5

Chemical Name: Poly(dicyclopentadiene-co-p-cresol)
CAS No.: 68610-51-5
Molecular Formula: C10H12·C7H8O·C4H8
Appearance: White to Cream Colored powder

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Poly(dicyclopentadiene-co-p-cresol) CAS 68610-51-5: Comprehensive User Guide

Table of Contents

1. Product Overview & Specifications

Parameter Poly(dicyclopentadiene-co-p-cresol) Common Alternatives
CAS Number 68610-51-5 N/A
Molecular Formula (C10H12·C7H8O)n Polystyrene: (C8H8)n
Thermal Stability Up to 280°C 240°C (Polycarbonate)
Chemical Resistance Excellent (acids, alkalis, solvents) Moderate (ABS Polymer)

2. Key Applications & Industry Uses

Core Functional Advantages:

  • High-performance coatings for aerospace components
  • Matrix material in carbon-fiber reinforced composites
  • Chemical-resistant adhesives in harsh environments
  • Dielectric materials in electronics encapsulation
  • Corrosion protection in offshore oil platforms

3. Real-World Case Studies

Case 1: Aerospace Turbine Components

Client: ABC Aerospace (Global Top 5 Engine Manufacturer)

Challenge: Required 15% weight reduction without compromising heat resistance (250°C continuous operation)

Solution: Implemented DCPD-p-cresol composite achieving 18% weight savings and 20% better thermal cycling performance vs legacy epoxy systems

Case 2: Semiconductor Encapsulation

Client: TechNova Electronics

Challenge: Prevent ionic contamination in 5G RF modules operating at 28GHz

Solution: Ultra-low dielectric loss formulation (Dk=2.8 @ 10GHz) meeting JEDEC Level 1 moisture sensitivity

4. Procurement & Supplier Selection Guide

Evaluation Criteria Technical Requirements Quality Benchmarks
Purity Level ≥99.7% (HPLC) ISO 9001:2015 certified production
Viscosity Range 500-2,000 cP @25°C ASTM D445 compliance
Gel Time 8-15 minutes (customizable) Controlled catalyst delivery systems

5. Request Customized Solutions

Contact Our Polymer Experts:

Technical Support Services Include:

  • Custom monomer ratio optimization (DCPD:p-cresol from 70:30 to 85:15)
  • Co-development of application-specific curing profiles
  • Batch-to-batch consistency (σ ≤0.5% molecular weight distribution)
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