Iminothiourazole/3-amino-5-mercapto-1,2,4-triazole (CAS 16691-43-3) Comprehensive Guide 2025
Table of Contents
- 1. Product Specifications & Comparative Analysis
- 2. Key Applications & Industrial Uses
- 3. Operational Guidelines & Best Practices
- 4. Industry-Specific Use Cases
- 5. Verified Client Success Stories
- 6. Technical Consultation & Procurement
1. Product Specifications & Comparative Analysis
| Parameter | Specification | Competitor A | Competitor B |
|---|---|---|---|
| Chemical Name | 3-amino-5-mercapto-1,2,4-triazole | 2-mercaptobenzimidazole | 1H-1,2,4-Triazole-3-thiol |
| CAS Number | 16691-43-3 | 583-39-1 | 3179-31-5 |
| Purity | ≥99.5% | 98.0-99.0% | 97.5-98.5% |
| Solubility | Water: 50mg/mL DMSO: 100mg/mL |
Water: 30mg/mL | Water: 25mg/mL |
2. Key Applications & Industrial Uses
Pharmaceutical Intermediate
Critical component in synthesis of:
- Anticancer agents (e.g., Temozolomide analogs)
- Antiviral drug precursors
- Thyroid regulation compounds
Electronics Manufacturing
- Copper corrosion inhibitor for semiconductor plating baths
- PCB surface treatment formulations
Advanced Material Science
- Ligand for transition metal complexes
- Self-healing polymer additives
3. Operational Guidelines & Best Practices
Storage Requirements
- Temperature: 2-8°C in sealed containers
- Humidity: ≤30% RH
Reaction Optimization
| Application | Optimal Concentration | Temperature Range |
|---|---|---|
| Nucleophilic Substitution | 0.1-0.3M | 40-60°C |
| Metal Chelation | 1:1.2 molar ratio | 25-35°C |
4. Industry-Specific Use Cases
Case 1: Oncology Drug Development
Challenge: Improve yield of Glioblastoma treatment API
Solution: Implemented as cyclocondensation agent
Result: 22% yield increase vs traditional methods
Case 2: High-Density Interconnect PCB
Challenge: Prevent copper dendrite growth
Solution: 0.05% additive in electroplating bath
Result: 5X improvement in surface uniformity
5. Verified Client Success Stories
Client 1: Top 10 Pharma Company (Confidential)
- Application: Kinase inhibitor scaffold synthesis
- Volume: 150kg/year
- Outcome: Reduced synthesis steps from 7 to 4
Client 2: Semiconductor Manufacturer
- Application: 3nm node copper interconnects
- Implementation: 2024 Q2 production
- Result: 18% wafer yield improvement
6. Technical Consultation & Procurement
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