Table of Contents
1. Dicyclopentadiene Diepoxide (CAS 81-21-0): Product Overview
Chemical Name: Dicyclopentadiene diepoxide
CAS Number: 81-21-0
Molecular Formula: C10H12O2
Appearance: Clear viscous liquid
Purity: ≥99%
| Parameter | Dicyclopentadiene Diepoxide | Bisphenol-A Epoxy | Phenolic Novolac Epoxy |
|---|---|---|---|
| Heat Resistance (°C) | 220-250 | 150-180 | 200-230 |
| Viscosity @25°C (cPs) | 800-1,200 | 12,000-15,000 | 3,000-5,000 |
2. Industrial Applications
2.1 Advanced Electronic Encapsulation
Preferred for microchip encapsulation due to:
- Low ionic impurity (<10 ppm)
- CTE matching with silicon substrates
2.2 Aerospace Composites
Enables production of carbon fiber-reinforced polymers (CFRPs) with:
- 40% higher impact resistance vs standard resins
- 15% weight reduction in structural components
3. Technical Implementation
3.1 Optimal Curing Conditions
| Curing Agent | Ratio | Gel Time | Full Cure |
|---|---|---|---|
| Anhydride HET | 100:85 | 45min @120°C | 2hrs @150°C |
4. Verified Client Implementations
4.1 ABC Electronics (Shenzhen) Co., Ltd.
Challenge: Delamination in high-power LED modules
Solution: Implemented our diepoxide in transfer molding process
Outcome: 62% reduction in thermal stress failures
4.2 Defense Materials Inc.
Application: Radar-absorbing aircraft components
Benefit: Achieved MIL-STD-810H compliance for thermal cycling
5. Technical Consultation & Sampling
Contact our epoxy specialists:
✉️ info@vivalr.com
+86 158 6678 1826
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