o/p-Toluenesulfonamide formuladehyde resin CAS 1338-51-8

Table of Contents

• Product Overview
• Specifications & Comparison
• Applications
• Usage Guide
• Case Studies
• Inquiry & Contact

p-Toluenesulfonamide Formaldehyde Resin (CAS 1338-51-8)

Synonyms: TSFR, Tosylamide Formaldehyde Resin

CAS Number: 1338-51-8

Molecular Formula: C₁₅H₁₇NO₃S

Appearance: White to off-white powder

Key Features: High thermal stability, excellent adhesion, chemical resistance, and compatibility with polymers.

Specifications & Comparison

Applications

1. Coatings & Adhesives

Used as a crosslinking agent to enhance scratch resistance and durability in automotive/industrial coatings.

2. Plastics & Polymers

Improves mechanical strength and heat resistance in engineering plastics like nylon and polycarbonate.

3. Electronics

Critical component in epoxy encapsulants for semiconductor protection under high-temperature conditions.

Usage Guidelines

Recommended Dosage

• Coatings: 5-10% by weight
• Adhesives: 3-8% by weight

Processing Conditions

• Mixing Temperature: 50-80°C
• Curing Time: 20-60 minutes at 120-150°C

Case Studies

Case 1: Automotive Coatings Manufacturer

Problem: Needed to reduce coating defects under extreme temperatures.

Solution: 8% TSFR added to epoxy-based coating formulation.

Result: 40% improvement in thermal resistance and 25% longer service life.

Case 2: Electronics Encapsulant Supplier

Challenge: Delamination issues in high-power LED packaging.

Implementation: TSFR-modified epoxy system at 6% loading.

Outcome: Zero delamination at 180°C operating temperature; passed 1000h reliability testing.

Inquiry & Contact

Request samples or technical datasheets:

Email: info@vivalr.com

Phone: (86) 15866781826

Why Choose Us?

• ISO 9001-certified production
• Custom particle size & surface treatment options
• 24/7 technical support