2,2-Bis(4-carboxyphenyl)hexafluoropropane CAS 1171-47-7

2,2-Bis(4-carboxyphenyl)hexafluoropropane CAS 1171-47-7: Technical Guide & Industry Applications

Contents

• 1. Product Overview & Specifications
• 2. Key Applications & Functional Advantages
• 3. Usage Scenarios by Industry
• 4. Comparative Analysis with Alternative Materials
• 5. Verified Client Implementations
• 6. Procurement Guidance

1. Product Overview & Specifications

2. Key Applications & Functional Advantages

Primary Industrial Uses:

• High-performance polymer synthesis (polyimides, polyesters)
• Advanced electronic packaging materials
• Fluorinated epoxy resin modifiers
• Pharmaceutical intermediates

Performance Advantages:

3. Usage Scenarios by Industry

Electronics Manufacturing:

Applied in underfill materials for BGA packages, demonstrating 38% improvement in thermal cycling resistance vs standard anhydrides.

Aerospace Coatings:

Modified epoxy systems show 92% retention of adhesive strength after 500hr salt spray testing.

Medical Devices:

Enables production of radiopaque polymer components with 0.05mm dimensional stability at sterilization temperatures.

4. Comparative Analysis

5. Verified Client Implementations

Case 1: Flexible Printed Circuit Producer (Taiwan)

Challenge: Required high-Tg polyimide (＞280°C) with improved flexibility
Solution: 15% loading in resin formulation
Outcome: Achieved 285°C Tg with 180° bending radius

Case 2: EV Battery Manufacturer (Germany)

Challenge: Thermal management in battery encapsulants
Solution: Composite matrix modification
Outcome: 22% higher thermal conductivity vs previous material

6. Procurement Guidance

Available formats:
– Technical Grade: 98.5% purity (batch consistency ±0.3%)
– Electronic Grade: 99.9% purity (metal content ＜5ppm)

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