Methylhexahydrophthalic Anhydride (CAS 25550-51-0) User Guide
Table of Contents
1. Product Overview & Technical Specifications
Methylhexahydrophthalic Anhydride (MHPA) is an advanced epoxy resin curing agent with CAS registry number 25550-51-0. Key parameters:
| Parameter | Specification | Competitor A | Competitor B |
|---|---|---|---|
| Purity | ≥99.5% | 98.8% | 97.2% |
| Viscosity @25°C | 50-70 mPa·s | 85-110 mPa·s | 120-150 mPa·s |
| Acid Value | 660-680 mg KOH/g | 630-650 mg KOH/g | 600-620 mg KOH/g |
2. Key Applications & Industry Uses
MHPA is predominantly utilized in:
- High-performance epoxy resin systems for aerospace composites
- Electronic encapsulation materials for semiconductor protection
- Industrial coating formulations requiring chemical resistance
- Electrical laminates for PCB manufacturing
- Adhesive systems with thermal stability up to 180°C
3. Operational Guidelines & Best Practices
3.1 Curing Process Optimization
Recommended curing schedule:
- Initial heating: 80°C for 30 minutes
- Gradient heating: 120°C for 2 hours
- Post-curing: 150°C for 1 hour
3.2 Safety Protocols
- Use PPE including chemical goggles and nitrile gloves
- Maintain ventilation rates ≥15 air changes/hour
- Store in nitrogen-purged containers below 30°C
4. Comparative Analysis with Alternatives
| Property | MHPA | MTHPA | HHPA |
|---|---|---|---|
| Glass Transition Temp | 148°C | 135°C | 122°C |
| Dielectric Strength | 22 kV/mm | 18 kV/mm | 15 kV/mm |
5. Verified Customer Implementations
Case 1: Aerospace Component Manufacturer
Client: Top 3 aerospace supplier (NDA-protected)
Application: Composite wing structures curing
Results: 22% improvement in flexural strength vs previous formulation
Case 2: Electronics Assembly Specialist
Client: Global EMS provider
Application: Underfill encapsulation for BGA packages
Results: Reduced void content to <0.5% with 35% faster curing
6. Technical Consultation & Ordering
For technical specifications sheets or bulk pricing:
Email: info@vivalr.comTel: (86) 15866781826
Request a free 1L sample for material testing and evaluation.
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