dl-sec-butyl acetate cas 105-46-4

Table of Contents

• DL-Sec-Butyl Acetate (CAS 105-46-4) Overview
• Technical Specifications & Comparative Analysis
• Industrial Applications & Functional Advantages
• Operational Guidelines & Safety Protocols
• Client Case Studies: Performance Validation
• Contact for Technical Consultation & Bulk Orders

DL-Sec-Butyl Acetate (CAS 105-46-4) Overview

DL-Sec-Butyl Acetate (CAS 105-46-4), a high-purity ester solvent, is characterized by its molecular formula C6H12O2 and molecular weight 116.16 g/mol. This colorless liquid with a fruity odor demonstrates a boiling point of 112-114°C and flash point of 22°C, making it suitable for industrial applications requiring moderate evaporation rates.

Technical Specifications & Comparative Analysis

Industrial Applications & Functional Advantages

Primary Use Cases:

• Coatings Industry: High-solvency power for nitrocellulose lacquers (15-25% faster drying vs. n-butyl acetate)
• Ink Formulation: Balanced evaporation profile prevents blushing in printing processes
• Pharmaceuticals: EPA-approved reaction medium for API crystallization (ICH Q3C Class 3 solvent)
• Electronics: Precision cleaning agent for semiconductor substrates (≤5ppm ionic contamination)

Operational Guidelines & Safety Protocols

Optimal Handling Parameters:

• Storage Temperature: 15-25°C in nitrogen-inerted containers
• VOC Content: 780 g/l (compliant with EU Directive 2004/42/CE)
• PPE Requirements: Butyl rubber gloves + A2/P2 respiratory protection above 50 ppm
• Waste Treatment: Incineration at ≥1000°C with SCR system

Client Case Studies: Performance Validation

Case 1: Automotive Coatings Manufacturer (Germany)

Challenge: Reduce baking oven energy consumption while maintaining coating flow properties
Solution: 30% substitution of n-butyl acetate with DL-Sec-Butyl Acetate
Results: 18% lower oven temperature (165°C → 135°C), 22% energy savings, maintained 85μm dry film thickness

Case 2: Flexible PCB Producer (China)

Challenge: Eliminate ionic residues post-etching without damaging polyimide layers
Solution: Implemented 7% DL-Sec-Butyl Acetate in cleaning solution
Results: Achieved <1μg/cm² residual copper, increased production yield by 13.7%

Contact for Technical Consultation & Bulk Orders

For material specifications, regulatory documentation (REACH, FDA 21 CFR 175.300), or customized formulation support:
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