Dimethoxymethyl Phenylsilane CAS 3027-21-2

Appearance: Colorless transparent liquid
Purity: 99.0%min
Packing: 250kg/drum
Capacity: 1440MT/Year
Sample: Available
related documents:

COA of Dimethoxymethyl Phenylsilane CAS 3027-21-2
TDS of Dimethoxymethyl Phenylsilane CAS 3027-21-2
SDS of Dimethoxymethyl Phenylsilane CAS 3027-21-2

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Dimethoxymethyl Phenylsilane CAS 3027-21-2: Comprehensive Guide for Industrial Applications

Table of Contents

1. Product Overview & Key Specifications

Parameter Specification
CAS Number 3027-21-2
Molecular Formula C9H14O2Si
Molecular Weight 182.29 g/mol
Appearance Colorless to pale yellow liquid
Purity ≥98% (GC Analysis)
Boiling Point 230-235°C at 760 mmHg
Density 1.02 g/cm³ at 25°C
Flash Point 112°C (Closed Cup)
Refractive Index n20/D 1.493

2. Industrial Applications & Functional Advantages

Core Functional Benefits:

  • Superior coupling efficiency in polymer matrices
  • Enhanced thermal stability (up to 300°C)
  • Low VOC emission profile

Industry-Specific Applications:

  • Adhesive Manufacturing: Improves cross-linking density in silicone-based adhesives
  • Electronic Encapsulants: Reduces dielectric constant by 15-20% in epoxy formulations
  • Coating Systems: Increases hydrophobicity (contact angle >110°) in protective coatings

3. Operational Guidelines & Safety Protocols

Storage Requirements:

  • Maintain inert atmosphere (N₂ blanket recommended)
  • Storage temperature: -5°C to 30°C

Handling Precautions:

  • Use NIOSH-approved respirator when vapor concentration exceeds 50 ppm
  • Chemical-resistant gloves (Butyl rubber ≥0.4mm)

4. Comparative Analysis with Alternative Silanes

Property Dimethoxymethyl Phenylsilane Trimethylchlorosilane Phenyltrimethoxysilane
Hydrolysis Rate Moderate (t½=45min) Fast (t½=8min) Slow (t½=120min)
pH Stability 4-9 6-8 3-10
Adhesion Improvement +35% vs. control +15% +28%

5. Real-World Application Case Studies

Case 1: High-Temperature Resistant Adhesive Development

  • Client: Leading European automotive supplier
  • Challenge: Required 300°C stability for engine component bonding
  • Solution: 2.5% additive in silicone formulation
  • Result: Achieved 320°C continuous operation capability

Case 2: Low-k Dielectric Material Production

  • Client: Asian semiconductor manufacturer
  • Challenge: Reduce dielectric constant below 2.6
  • Solution: 8% loading in polyimide matrix
  • Result: Achieved k=2.3 with 98% reliability at 150°C

6. Technical Inquiry & Procurement Support

For technical specifications or bulk pricing:
Email: info@vivalr.com
Tel: (86) 15866781826

Why Choose Our Product?

  • Batch-to-batch consistency (RSD <0.8%)
  • Customizable packaging (1kg to 1000kg containers)
  • 24/7 technical support team

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