N,N-Diglycidyl-4-Glycidyloxy Aniline (CAS 5026-74-4): Comprehensive User Guide
Table of Contents
1. Product Overview & Technical Specifications
N,N-Diglycidyl-4-glycidyloxy aniline (CAS 5026-74-4) is a high-performance trifunctional epoxy resin with the following characteristics:
| Parameter | Specification | Bisphenol A Epoxy | Novolac Epoxy |
|---|---|---|---|
| Epoxy Value (eq/100g) | 0.65-0.75 | 0.48-0.54 | 0.52-0.60 |
| Viscosity @25°C (mPa·s) | 800-1200 | 11,000-15,000 | 20,000-40,000 |
| Heat Distortion Temp (°C) | 155-165 | 110-130 | 140-150 |
2. Key Applications & Industrial Uses
2.1 Advanced Composite Materials
Used as matrix resin for carbon fiber-reinforced polymers (CFRP) in aerospace components, demonstrating 25% higher interlaminar shear strength compared to conventional resins.
2.2 Microelectronic Encapsulation
Provides 0.08% moisture absorption rate in semiconductor packaging, ensuring reliability in high-humidity environments.
3. Performance Comparison with Competing Epoxy Resins
| Property | CAS 5026-74-4 | TGDDM | DGEBA |
|---|---|---|---|
| Crosslink Density (mol/cm³) | 3.2×10⁻³ | 2.8×10⁻³ | 1.9×10⁻³ |
4. Operational Guidelines & Best Practices
4.1 Curing Process Parameters
Recommended curing schedule:
- Stage 1: 120°C × 2 hours
- Stage 2: 150°C × 3 hours
- Post-cure: 180°C × 1 hour
5. Real-World Case Studies
5.1 Aerospace Component Manufacturer
Client: Leading European aircraft parts supplier
Challenge: Required epoxy system with Tg >160°C for engine nacelles
Solution: Formulated CAS 5026-74-4 with diaminodiphenyl sulfone
Result: Achieved Tg of 172°C with 18% weight reduction
5.2 High-Frequency PCB Producer
Client: Asian 5G infrastructure manufacturer
Challenge: Needed dielectric constant <3.2 @10GHz
Application: Used as primary matrix in multilayer boards
Outcome: Maintained Dk=3.05 with 0.02 dissipation factor
6. Technical Inquiry & Custom Solutions
Contact our epoxy specialists for formulation support:
Email: info@vivalr.com
Phone: (86) 15866781826
Request SDS, technical data sheets, or customized curing profiles.
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