Neopentyl Glycol Diglycidyl Ether Cas 17557-23-2

Chemical Name: Neopentylglycol diglycidyl ether
CAS No.: 17557-23-2
Molecular Fomula: C11H20O4
Molecular weight: 216.27
Appearance: colorlessclearliquid
Assay: 18%
related documents:

COA of Neopentyl glycol diglycidyl ether CAS 17557-23-2
TDS of Neopentyl glycol diglycidyl ether CAS 17557-23-2

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Neopentyl Glycol Diglycidyl Ether (CAS 17557-23-2): Technical Guide for Industrial Applications

1. Product Overview & Specifications

Parameter Neopentyl Glycol Diglycidyl Ether Conventional Diluents
CAS Number 17557-23-2 Varies
Molecular Formula C11H20O4 Typically C8-12
Molecular Weight 216.27 g/mol 150-250 g/mol
Density (25°C) 1.04 g/mL 0.95-1.10 g/mL
Viscosity Low (5-15 mPa·s) 10-50 mPa·s
Epoxy Equivalent Weight 108-115 g/eq 100-130 g/eq
Flash Point >110°C 80-120°C

2. Key Applications & Industrial Uses

Core Functional Advantages:

  • Epoxy Resin Modification: Reduces viscosity by 40-60% while maintaining mechanical integrity
  • Crosslinking Enhancement: Dual epoxy groups enable 3D network formation
  • Chemical Resistance: Improves acid/alkali resistance by 30% vs. mono-functional alternatives

Industrial Sectors:

Industry Application Performance Benefit
Composite Materials Fiber-reinforced polymers 25% improvement in flexural strength
Protective Coatings Marine anti-corrosion systems Salt spray resistance >5,000 hours
Adhesive Formulations Structural bonding agents Peel strength ≥8 MPa
Electrical Encapsulation LED packaging compounds CTI ≥600V

3. Performance Advantages

  • Enables low-VOC formulations (≤50 g/L)
  • Extends pot life by 30-50% compared to standard diluents
  • Maintains >90% tensile strength after 1,000 thermal cycles (-40°C to +120°C)
  • Compatible with amine/anhydride curing systems

4. Practical Implementation Cases

Case A: Wind Turbine Blade Manufacturing

Challenge: Reduce resin viscosity without compromising fatigue resistance

Solution: 12-15% NPGDGE addition to epoxy matrix

Result: 45% faster infusion + 18% weight reduction

Case B: High-Speed PCB Encapsulation

Challenge: Prevent void formation in miniaturized components

Solution: 8% NPGDGE in silicone-epoxy hybrid system

Result: 99.7% void-free encapsulation at 0.2mm thickness

5. Client Success Stories

Client 1: European Automotive Supplier

Application: Brake composite pre-pregs

Outcome: Achieved 22% faster curing at 140°C with 15% energy savings

Client 2: Asian Electronics Manufacturer

Application: Thermal interface materials

Outcome: 5.8 W/m·K thermal conductivity with 20% cost reduction

Client 3: North American Aerospace Company

Application: Fuel tank sealants

Outcome: Passed MIL-S-8802E specification with 35% weight savings

Technical Consultation & Ordering

Email: info@vivalr.com

Phone: (86) 15866781826

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